Acf Bonding M/C

Contact Now* Send an Inquiry to this supplier.

Start Order * Name your price

Sekwang Technologies Co., Ltd.
[Korea]

Product Details

Quick Information

Function

This machine is used to attach the ACF tape on the TAB Film or Glass to improve the conductivity.

Features

Minute bonding pressure can be controlled by using low friction cylinder (MXS).
Size changing time can be minimized because it is not necessary to change ACF guiding roller when changing ACF tapewidth.
Easy Set up by stage moving to X,Y,θaxis.
Continuous operation is possible by adopting auto ACF tape feeding & ACF protective film separating type.
High accuracy for ACF feeding & ACF attaching within ±0.1mm by using Stepping Motor.

Specification

ITEM		MODEL : SK-ACF
Equipment	Dimensions(㎜)	750(W) x 600(L) x 1,300(H)
Equipment	Weight(㎏)	Approx. 210
Material	Input LCD Glass Size(㎜)	Width : 10-100, Length : 16-100
	Input ACF size(㎜)	Width : 1.0-8 , Length : 5-60
	Input ACF kind	2 layers or 3 layers film (Feeding tape, ACF, Protective film)
<Capacity	Tact Time(s)	4.5sec
Accuracy	Bonding Accuracy	X Axis :±0.20mm (by Stepping motor) Y Axis :±0.15mm
Utility	Input Power	1Φ AC220V, 50/60㎐x1.14Amp, 0.25kwh
Utility	Air Pressure	1st air: 5kg·f/㎠, 2nd air: 1.0kg·f/㎠ Air Consumption :50 LPM

Buyer	Transaction Information	Feed Back
No Data.

Other products from this supplier

Send an Inquiry to this supplier
* From
To	Dong-woo, Kim Sekwang Technologies Co., Ltd.
* Buying Product	- Please enter your specific buying item. e.g. 42 inch LCD TV, leather executive chair Category : LCD Modules
* Message	Use English only Max. 2000 characters. (Min. 20) Send
EC21.com does not guarantee the validity of product information or the credentials of sellers.